Die Bonder
Microsoudeuse de puces
Description
Quick Summary
The National Research Council Canada is seeking a supplier to deliver and supply a Die Bonder to their Advanced Electronics and Photonics Research Centre in Ottawa, Ontario. Interested suppliers can submit a statement of capabilities within 15 days to be considered for bidding. If no qualified suppliers respond, the contract may be awarded to a pre-identified supplier.
Ideal For
Companies specializing in the supply and delivery of semiconductor assembly equipment, particularly die bonders, should consider bidding.
Tender Details
- Reference Number
- cb-392-734254
- Solicitation Number
- 23-58184
- Publication Date
- Dec 6, 2023
- Closing Date
- Dec 21, 2023
- Expected Start
- Jan 5, 2024
- Expected End
- Mar 29, 2024
- Procurement Method
- Advance contract award notice
- Notice Type
- Advance Contract Award Notice
Classification
- UNSPSC Code
- 41100000
- UNSPSC Description
- Laboratory and scientific equipment
Trade Agreements
Canada-Honduras Free Trade Agreement; Canadian Free Trade Agreement (CFTA); Canada-Panama Free Trade Agreement; Canada-Chile Free Trade Agreement (CCFTA); Canada-Colombia Free Trade Agreement; Canada-Korea Free Trade Agreement (CKFTA)
Contracting Entity
National Research Council Canada
1200 Montreal Road
Ottawa, Ontario
Regions of Delivery
Ottawa
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